The instrument included double workbench,the left workbench can adhesive 2~6 inches sapphire ingot with the X-ray orientation unit,the minimum length of ingot is 20mm,and use the guide's glid to adhesive more ingot at a piece flitch ; The right workbench can test the end plane angle of 2~6 inches sapphire ingot or wafer with the X-ray orientation unit, wiht accuracy ±15"/30", the minimum reading by 1".
●Input power: Single phase with AC 220V,50Hz,0.25kW
●X-ray tube : Cu target ,cooled by fan ,and plus earth
●Max.tube voltage and current: 30kV ,5mA ,being continued adjustment. If using the current is more than 2.0mA ,which may be damaged the X-ray tube inserted and enlarge the radiative harm
●Detector: counter. The max. working voltage is DC1000V; Or scintillation counter,the max. working voltage is DC1200V
●Time setting : 1(fast)/2(slow)
●Angle range: 2θ=－10°～120°，θ=－5°～60°
●Angle reading : Digital displaying in minutes or seconds,
the minimum reading to 1"
Digital displaying in degree ,
the minimum reading to 0.001°
●Angle adjustment: Digital displaying can be set in the any angle .
●Main optical shutter: by manual
●Displaying :Angle displaying ,and Ray intensity table
●Comprehensive precision: double diffraction comprehensive accuracy±15″or±30″.(Measured with standard quartz ).
●External dimension :1132(L) ×642（W）×1460（H）mm