The instrument included double workbench,the left workbench can adhesive 2~6 inches sapphire ingot with the X-ray orientation unit, the minimum length of ingot is 20mm, adhesive more ingot at a piece flitch with guide's glide; the right workbench can test the end plane angle of 2~6 inches sapphire ingot or wafer with the X-ray orientation unit, instrument accuracy by ±15"/30", the minimum reading by 1".
●Input power: Single phase with AC 220V,50Hz,0.25kW
●X-ray tube: Cu target ,cooled by fan ,and plus earth
●Max.tube voltage and current :30kV ,5mA ,being continued adjustment .
●Detector: counter . The max. working voltage is DC1000V;Or scintillation counter, the max. working voltage is DC1200V
●Time setting : 1(fast)/2(slow)
●Angle range: 2θ=－10°～120°，θ=－5°～60°
●Angle reading : Digital displaying in minutes or seconds, the minimum reading to 1",Digital displaying in degree ,the minimum reading to 0.001°
●Angle adjustment :Digital displaying can be set in the any angle.
●Main optical shutter: by manual
●Displaying :Angle displaying ,and Ray intensity table
●Comprehensive precision: double diffraction comprehensive accuracy±15″or±30″.(Measured with standard quartz ).
●External dimension: 1132(L)×642(W)×1200(H)mm