The instrument is the whole closed type worktable, the left workbench can adhesive 2~6 inches sapphire ingot with the X-ray orientation unit,the minimum length of ingot is 20mm,and use the guide's glid to adhesive more ingot at a piece flitch ; The right workbench can test the end plane angle of 2~6 inches sapphire ingot or wafer with the X-ray orientation unit, wiht accuracy ±15"/30", the minimum reading by 1". Has the difference display function.
●Input power:Single phase with AC 220V,50Hz,0.25kW
●X-ray tube : Cu target ,cooled by fan ,and anodes earth
●Max.tube voltage and current: 30kV, 5mA, being continued adjustment .If using the current is more than 2.0mA ,which may damage the X-ray tube inserted and enlarge the radiative harm
●Detector: counter . The max. working voltage is DC1000V;Or scintillation counter,the max.working voltage is DC1200V
●Time set : 1(fast)/2(slow)
●Angle range: 2θ=－10°～120°，θ=－5°～60°
●Angle reading : Digital displaying in degree ,minute and second, the minimum reading to 1"
Digital displaying in degree, minute and second, with the difference value ,the minimum reading to 1"
Digital displaying in degree ,the minimum reading to 0.001°
Digital displaying in degree , with the difference value ,the minimum reading to 0.001°
●Angle adjustment: Digital displaying can be set in the any angle.
●Main shutter :auto
●Shield: totally close
●Displaying board: Angle displaying, and Ray intensity table
●Comprehensive precision: double diffraction comprehensive accuracy±15″or±30″.(Measured with standard quartz ).
●External dimension :1132(L) ×642（W）×1200（H）mm